title | media type | ISBN-13 | year of publica- tion | other author(s) | |
---|---|---|---|---|---|
Advanced Interconnects for ULSI Technology | Hardcover | 978-0-470-66254-0 | 2012 | Mikhail Baklanov · Ehrenfried Zschech | |
Advanced Interconnects for Ulsi Technology | Gedruckter Zugangscode | 978-1-119-96367-7 | 2012 | Mikhail Baklanov · Ehrenfried Zschech | |
Low Dielectric Constant Materials for IC Applications | Taschenbuch | 978-3-642-63221-1 | 2012 | Jihperng Leu · Wei William Lee | |
Low Dielectric Constant Materials for IC Applications | Gebunden | 978-3-540-67819-9 | 2002 | Jihperng Leu · Wei William Lee | |
Materials Reliability in Microelectronics III: Volume 309 | Paperback | 978-1-107-40948-4 | 2014 | Kenneth P. Rodbell · William F. Filter · Harold J. Frost | |
Materials Reliability Issues in Microelectronics: Volume 225 | " | 978-1-107-40987-3 | 2014 | James R. Lloyd · Frederick G. Yost | |
Stress Induced Phenomena in Metallization: Fourth International Workshop, Tokyo, Japan, June, 1997 | Hardcover | 978-1-56396-682-8 | 1998 | H. Okabayashi · S. Shingubara | |
Stress-Induced Phenomena in Metallization: Ninth International Workshop on Stress-Induced Phenomena in Metallization | " | 978-0-7354-0459-5 | 2007 | Shinichi Ogawa · Ehrenfried Zschech | |
Stress-Induced Phenomena in Metallization: Tenth International Workshop on Stress-Induced Phenomena in Metallization | " | 978-0-7354-0680-3 | 2009 | Ehrenfried Zschech · Shinichi Ogawa |
P. H. · P S · P. S. Ho · Paul S. · S H
American Institute of Physics · Cambridge University Press · Springer · Wiley