| Titel | Art | ISBN-13 | Erschei- nungsjahr | andere Autoren |
|---|---|---|---|---|
| 3D Stacked Chips: From Emerging Processes to Heterogeneous Systems | Gebunden | 978-3-319-20480-2 | 2016 | Gerhard Fettweis |
| Machine Learning in VLSI Computer-Aided Design | " | 978-3-030-04665-1 | 2019 | Duane S. Boning · Xin Li |
| MEMS Accelerometers | Taschenbuch | 978-3-03897-414-7 | 2019 | Mahmoud Rasras · Ha Duong Ngo |
| The IoT Physical Layer: Design and Implementation | " | 978-3-030-06588-1 | 2019 | Mohammed Ismail |
| The IoT Physical Layer: Design and Implementation | Gebunden | 978-3-319-93099-2 | 2018 | " |
A. E. · A.M. · I.A. · Ibrahim Elfadel · M.E