| title | media type | ISBN-13 (ISBN-10) | year of publica- tion | other author(s) |
|---|---|---|---|---|
| Advances in Embedded and Fan-Out Wafer Level Packaging Technologies | Hardcover | 978-1-119-31413-4 (1-119-31413-5) | 2019 | Steffen Kroehnert |
| Advances in Embedded and Fan-Out Wafer Level Packaging Technologies | Digital | 978-1-119-31397-7 (1-119-31397-X) | 2018 | " |
Beata Kozyra · Beata Kuczera · Beate Kaiser · Beate Kaisser · Bette Keyser · Betty Kiser · Bodo Kayser